Shenzhen WonDa Technology Co., Ltd.
Shenzhen WonDa Technology Co., Ltd. Your Reliable Partner For Pcb Production.
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multilayer PCB board for MITSUBISHI Electric,lead-free pcb,pcb manufacturer in shenzhen
1)Electric test 100%
2)No MOV
Welcome to WonDa PCB Technologies Manufacturer !
Our WonDa advantage
1. Excellent quality and competitive price ;
2. High Technology Capability: Min: 3mil/3mil trace/space, Min drill: 4mil .up to 30 layers.
3. Fast and timely delivery.
4. Related Quality certification: UL E320829 / ISO9001 / TS16949
Our products are used to :
Telecommunication equipment,Electric equipment,Industrial control,Digital,
Transportation,Medical instruments,and Led/wireless products field etc.
We WonDa offering Rigid, Flex and Flex-Rigid PCB to our customers all over the world !
| WonDa Rigid Capability | |
| Laminates type | FR-4,CEM-1,CEM-3,BT Resin, Teflon,PTFE,Halogen Free |
| Rogers,Aluminium, Tg130°C(150°C,170 °C,180 °C 210°C), Berquist, Thermagon,Alon.Polyclad | |
| Board thickness |
Min: 2-Layer: 0.2 mm -6.0 mm 4-Layer: 0.40mm -8.0mm 6-Layer: 0.8 mm -8.0 mm 8-Layer: 1.0 mm -8.0mm 10-Layer: 1.2 mm -8.0 mm 12-Layer: 1.5 mm -8.0mm Max: 8mm (0.3150") |
| Base copper thickness |
Mass production: Min: 12um (1/3oz) Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer Sample: Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer |
| Min finished hole size | By mechanical drilling: 0.15mm (0.006") |
| By laser drilling: 0.05mm (0.002") | |
| Aspect ratio | 12:01 |
| Max panel size | Mass production, 540mm × 740m (21.25" × 29.13") |
| Sample: 700mm × 1100mm (27.56" × 43.3") | |
| Min line width/space | Mass production: 3mil/3mil |
| Sample: | |
| Inner layer: 0.0635mm/0.0635mm (0.0025"/0.0025") | |
| Outer layer: 0.0585mm/0.0585mm (0.0023"/0.0023") | |
| Via hole type | Blind/Burried/Plugged |
| HDI/Microvia | YES |
| Surface finish | HASL / Lead Free HASL |
| Immersion Gold / Silver / Tin | |
| Flash Gold. Hard Gold plating | |
| Selective thick Gold Plating | |
| Gold Finger (Gold thickness up to 3um) | |
| Plating Silver (Silver through Hole, | |
| Carbon ink, Peelable mark, OSP | |
| Solder mask | All kinds of colour |
| LPI, Dry Film | |
| Min S/M pitch (LPI): 0.1mm | |
| Impedance Control | Single trace or differential controlled |
| 50, 60, 70, 100, 110, 120, 130 ±5% | |
| Min bonding pitch | 0.181mm (center to center) |
| Min SMT pitch | 0.400mm (center to center) |
| Min annular ring | 0.025mm |
| Outline finish type | CNC Routing; V-Scoring/Cut; Punch |
| Tolerances |
Min Hole registration tolerance (NPTH) ± 0.025mm Min Hole registration tolerance (PTH) ± 0.075mm Min Pattern registration tolerance ± 0.05mm Min S/M registration tolerance (LPI) ± 0.075mm Scoring Lines ± 0.15mm Board thickness (0.1 -1.0mm ) ±15% Board thickness (1.0 -6.35mm ) ±10% Board Size Routed ± 0.1mm Board Size Scored ± 0.2mm |
| Electrical Testing |
Voltage 10V - 250V Continuity 10 - 1000 Ohms |